TSMC taps Nvidia AI to speed up next-gen chipmaking

TSMC is using Nvidia AI and accelerated computing tools to speed up advanced chip design and manufacturing in its factories, Nvidia said. The world's largest contract chipmaker is applying Nvidia CUDA-X libraries and AI models across semiconductor design, manufacturing, lithography, inspection and fab operations. Nvidia founder and chief executive Jensen Huang said the companies have worked together for nearly three decades to push the limits of computing. He said TSMC is bringing Nvidia AI and accelerated computing into the fab itself to tackle complex design and manufacturing challenges with simulation, optimization and AI to improve speed, efficiency and yield for the next generation of chips. TSMC chairman and chief executive C.C. Wei said the pair had built a long-standing partnership rooted in advancing the technologies that make the next generation of computing possible. He said by using Nvidia accelerated computing and AI across fab operations optimization, lithography, process control and inspection, TSMC is strengthening its technology leadership and manufacturing excellence to support customers' future products and success. TSMC is using Nvidia cuLitho for computational lithography, which Nvidia claims delivers a 20 to 50 percent improvement in cost effectiveness or cycle time compared with CPU-based methods. The chipmaker also uses Nvidia cuEST for transistor and process simulation, cuML for advanced process control analytics, and CUDA-powered scheduling on Nvidia H200 GPUs for fab operations.