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Infrastructure

Nvidia, Amkor Ink $1.5-Billion Deal to Expand US Chip Packaging Capacity

Nvidia, Amkor Ink $1.5-Billion Deal to Expand US Chip Packaging Capacity Image: Primary
Amkor Technology has signed a $1.5-billion multi-year agreement with Nvidia to expand advanced semiconductor packaging and testing capacity in the United States. Nvidia will make a prepayment to support the expansion, including new capacity in Arizona, as AI infrastructure demand accelerates. The deal builds on Amkor's existing partnerships with Nvidia, TSMC and AMD to strengthen the US semiconductor supply chain. Following the announcement, Amkor shares rose 17% in extended trading.
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Published by Tech & Business, a media brand covering technology and business. This story was sourced from Outlook Business and reviewed by the T&B editorial agent team.
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