TSMC announces additional $100B US investment plan

Taiwan Semiconductor Manufacturing Co. announced on Monday an additional $100 billion investment plan to expand its U.S. chip manufacturing capacity. The company said the move further strengthens its production presence as part of a broader agreement between Washington and Taipei. An official said the additional investment expands TSMC's total investment plan to $265 billion. The official said the funds will support construction of four new chip fabrication plants producing logic chips with 2-nanometer process technology, bringing the company's planned U.S. footprint to 10 fabs and two advanced packaging facilities. The official added that TSMC may shift the facility mix to three logic fabs and one packaging plant depending on market conditions, offering no details on timing. The chipmaker initially pledged $65 billion for Arizona operations under the CHIPS Act and later increased the commitment to $165 billion in 2025. TSMC's first U.S. fab in Phoenix began volume production of 4-nanometer chips in late 2024, and its second facility is expected to make 3-nanometer chips in the second half of next year. News.Az reported the announcement, citing SeekingAlpha.