IBM plans early nanostack chip design kit for first quarter of 2027

IBM plans to make an early research and development process design kit for its 7-angstrom nanostack technology available in the first quarter of 2027. The kit will give chip designers models, design rules and libraries to evaluate an architecture that stacks n-type and p-type transistors above one another instead of placing them side by side. The first version is expected to include example logic-cell libraries and an SRAM design for investigating chip layouts, density, power and performance. Potential collaborators include chip companies, design software vendors, equipment suppliers and researchers. The initial kit will omit some models found in mature commercial kits and support collaborative research before widespread adoption.